Docu BentoIO Heatsink CM5 Low Profile V3
Version 3.0
Key Features
- Ultra-Low Profile Design: With a height of just 5 mm, it’s ideal for compact enclosures and space-constrained applications.
- High-Quality Material: Constructed from copper, ensuring excellent thermal conductivity for effective passive cooling.
- Precise Dimensions: Measures 54 x 39 mm, perfectly matching the Raspberry Pi CM5 footprint.
- Secure Mounting: Features M2.5 mounting holes for stable and straightforward installation from the top.
- Complete Installation Kit:
- 1 x Copper Heatsink
- 4 x M2.5 H4mm Scews
- 4 x M2.5 H3+4mm Hex Brass Standoff Spacer
- 4 x Thermal Pad (Conductivity 3.0 W/(m·K), Hardness 2.0 Shore A)
- 17 × 13 × 1 mm
- 13 × 13 × 2 mm
- 13 × 13 × 1.5 mm
- 9 × 9 × 2 mm